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所在平台: Udemy |
课程主页: https://www.udemy.com/course/thermal-management-of-electronics-basics-to-advanced/
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**课程名称：** 电子设备热管理：从基础到高级 **课程概述：** 本课程旨在解决当今快速发展的电子技术领域中普遍存在的电子设备过热问题。随着电子产品的小型化和功能集成度的提升，过热已成为降低组件寿命和安全性的关键挑战。 本课程将深入探讨电子设备热管理的各个层面，包括： * **课程介绍** * **电子热管理的重要性及原因** * **不同层面的热管理挑战：** * 组件级 * PCB（印刷电路板）级 * 封装级 * **关键概念：** * “表面温度”概念 * **热传递模式：** 传导、对流和辐射（附带插图说明） * **牛顿冷却定律 (NLC)** 在热管理中的应用 * **热流率和热阻计算：** 并联导体的计算方法 * **总热通量和总热阻的推导** * **维德曼-弗兰兹定律** 在热电等效关系中的作用 * **热-电回路类比** * **热管理材料：** * 选择最佳铝合金用于热管理 * 用于制造散热器的铜合金 * 铝合金与铜合金的对比 * **热界面材料 (TIMs)** 的作用 * 常用热管理技术深度解析：散热垫、T.L.G.F.、导热凝胶、导热膏 * **相变材料 (PCM)** 的概念与应用 * **重要的热设计法则：** 四大重要热设计规则 * **当前先进的热管理材料：** 铝-金刚石、铜-金刚石、铝硅碳、铝硅 本课程将帮助学员全面理解电子设备热管理的基础知识和前沿技术。
Disclaimer: Please view the videos in HD mode (high pixel resolution) for more clearance.Hello ,My Name Is Riya Pal & I Welcome You To This Course.In This World Of Fast Growing Electronics Technology , 1000 Of New Electronics Products Are Launched In The Market Place Every Day And In Every Field Of Electronics Such As Consumer Electronics , Medical Electronics , Defence Electronics , Aerospace Electronics , Communication Electronics & Industrial Electronics. Because Of MINIATURIZATION So As To Make Electronics Devices Handy To Use , Over Heating Of The Electronics Devices Has Become A Serious Problem Because This Has Resulted In The Reduction Of The Lifespan Of The Components As Well As Has Lowered The Safety Level.This Course Has Been Designed Looking At The Requirement By The Students. Through This Course , Students Will Come To Know The Existing Scenario Of The Electronics World. This Course Will Provide You In-Depth Knowledge On The Below Topics:Course IntroductionThe Reasons Behind The Need Of Thermal Management In The Field Of ElectronicsThermal Management Challenges At "Component Level"Thermal Management Challenges At "PCB Level"Thermal Management Challenges At "Packaging Level"Concept Of "Skin Temperature"Modes Of Heat Transfer: Conduction / Convection & Radiation With IllustrationNewton's Law Of Cooling (NLC) In Thermal ManagementHow To Calculate 'Heat Flow Rate' And 'Thermal Resistance' In Parallel Connected ConductorsDerivation On: Total Heat Flux & Total Thermal ResistanceRole Of WIEDEMANN FRANZ LAW In Thermal And Electrical Equivalent RelationshipsAnalog Between Thermal Circuit And Electrical CircuitWhich Aluminium Alloy Is Best For Thermal Management ?Which Copper (Cu) Alloys Is Used To Manufacture Heat Sink ?Al_Alloys Versus Cu_AlloysRole Of Thermal Interface Materials (TIMs) In Thermal ManagementIn-depth Knowledge On Currently Used Thermal Management Techniques: Thermal Pads / T.L.G.F / Thermal Gels / Thermal PasteConcept & Application Of PCM (Phase Change Material)4 Important Thermal Designs RulesCurrent Advanced Thermal Management Materials: Al-Diamond / Cu-Diamond / AlSiC / AlSi
