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所在平台: Udemy |
课程主页: https://www.udemy.com/course/semiconductor-process-integration-semiconductor-academy-6/
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课程名称：半导体工艺集成（半导体学苑6） 课程概述：该课程提供了关于半导体工艺流程和高介电常数金属栅（HKMG）技术的全面介绍。您将学习关键的工艺概念以及每个工艺步骤的目的，帮助您掌握进入半导体代工厂所需的先进知识和技能。 学习内容： 1. 半导体制造简介 - 半导体：现代电子产品的基础 - 简史：从晶体管到微芯片 - 摩尔定律及其对工艺技术的影响 - 完整的工艺流程概述 2. 基本半导体工艺步骤概述 - 晶圆制造：硅锭生长和晶圆切割 - 前道工序（FEOL）：晶体管形成 - 后道工序（BEOL）：互连形成 - 测试与封装：确保功能性与可靠性 - 四个关键工艺模块 3. 前道工序（FEOL）：晶体管形成 - 浅沟道隔离（STI）工程 - 存储井工程 - 栅极工程 - 轻掺杂源/drain（LDD）/隔离层工程 - 热载流子注入（HCI）效应简介 - 其他注入工程，包括阈值电压注入和鞘注入 4. 后道工序（BEOL）：互连形成 - 硅化物工程 - 层间绝缘（ILD）工程 - 接触工程 - 金属层工程/双重镀膜工艺 - 层间金属绝缘（IMD）/过孔工程 - 钝化工程 5. 高介电常数金属栅（HKMG）技术 - HKMG的定义及其优势 - HKMG与聚合物栅的比较 - HKMG工艺流程 6. 结尾与展望 - 从过去的课程到未来课程的概述 该课程适合希望深入了解半导体生产环节与先进技术的学习者，为职业发展打下坚实基础。
This course provides a comprehensive overview of semiconductor process flow and HKMG technique. You'll learn critical process concepts and purpose of each process step, equipping you with the state-of-the-art knowledge and skills to enter the semiconductor foundries.What you will learn in this class ? (1) Introduction to Semiconductor ManufacturingSemiconductors: The foundation of modern electronicsBrief history: From transistors to microchipsMoore's Law and its impact on process technologyOverview of the complete process flow(2) Basic Semiconductor Process Steps: An OverviewWafer fabrication: Silicon ingot growth and wafer slicingFront-end-of-line (FEOL): Transistor formation Back-end-of-line (BEOL): Interconnect formationTesting and packaging: Ensuring functionality and reliabilityFour Key Process Modules(3) Front-End-of-Line (FEOL): Transistor Formation, including the following steps, STI (Shallow Trench Isolation) engineeringWell engineeringGate engineeringLDD (Lightly Doped Drain)/ Spacer/ Source & Drain engineeringIntroduction to HCI (Hot Carrier Injection) effectOther Implantation engineering including Vt Implantation and Halo Implantation (4) Back-End-of-Line (BEOL): Interconnect Formation, including the following steps, Silicide engineering ILD (Inter-Layer Dielectric) engineeringContact engineeringMetal layer engineering / Dual Damascene processIMD (Inter-Metal Dielectric) / Via engineering Passivation engineering (5) HKMG (High-K Metal Gate) techniqueWhat is HKMG and its advantageComparison between HKMG and Poly GateHKMG Process Flow(6) Ending & Forecast:An overview from past courses to future courses
