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所在平台: Udemy |
课程主页: https://www.udemy.com/course/pcbelectronics-thermal-management-derating-fundamentals/
课程评论：没有评论
## Coursera 课程总结：PCB/电子产品热管理、散热与降额设计 本课程深入探讨了 PCB 设计中的散热、热管理和降额（Derating）等关键概念。课程以清晰的逻辑脉络，引导学员完成热设计全过程。 **核心内容概览：** * **功率计算与热平衡判断：** 课程首先介绍不同类型元器件的功耗计算方法，并分析热平衡状态是否理想。若非最优，则引出热管理策略的必要性。 * **散热器（Heatsink）应用：** 作为最常用的散热方式，课程详细讲解散热器的特性、安装技术、关键参数及其应用。 * **热界面材料（TIM）：** 介绍用于连接散热器与集成电路的热界面材料的种类、特性及其重要作用。 * **强制风冷技术：** 探讨强制风冷，包括风扇性能计算及其对散热器热阻的影响。 * **PCB 热管理相关技术：** 重点介绍与 PCB 相关的热管理技术，尤其是在元器件出现裸露焊盘（Exposed Pad）时。 * **热管理策略制定：** 课程结束后，学员将能够理解热管理的需求，并掌握影响设计变量（如海拔、均热电阻等）的全面热管理策略。 * **降额（Derating）设计：** 课程专门开辟一节，详解“再额定”（Re-rating）与“降额”（De-rating）的概念。重点分析其对电子器件可靠性及预期寿命（MTBF，平均无故障时间）的影响。同时，展示主流电子元器件的降额方法以及哪些参数会因此被降低。 * **实践与真实案例：** 课程融入了大量练习和实际生活案例，通过分析真实器件的数据手册，展示参数的获取和实际应用。 **学习成果：** 完成本课程后，学员将： * 对热/散热管理及降额设计有更全面的理解。 * 能够设计出有效管理功耗（及相关温升）的 PCB。 * 能够基于正确的降额考量，合理选择元器件参数。 * 最终能够设计出能够承受热应力和电气应力，并在实际环境中可靠工作的 PCB。
This course is about cooling, thermal management and derating in PCB design. After introducing the basic definitions, it provides a clear and logical path to a complete design of thermal aspects. - It starts with calculating the dissipated power for different types of components, and understanding whether the thermal equilibrium is optimal or we need a thermal management strategy. - Then it introduces heat sinks, which is by far the most used cooling approach, talking about their features, mounting techniques, parameters and so on. - Than it speaks about thermal interface materials, used to couple heat sinks to integrated circuits, their types and characteristics. - It also speaks about the forced air cooling technique, introducing how to calculate a fan performance and its impact on the heat sink thermal resistance. - Then it explains PCB related aspects for thermal management, of particular relevance when the used devices have exposed pads. At the end of these group of lessons, you will be able to understand the need for thermal management and provide your design with a comprehensive strategy mastering all the related aspects and variables influencing it (like altitude, spreading resistance, etc. ) Then the course dedicate an entire section to a related and very important aspect: derating. It explain the concept of re-rating and de-rating, its impact on electronic devices reliability and expected life (MTBF, Mean Time Between Failure, nowadays often used instead of MTTF, Mean Time To Failure), and it shows how the most used electronic components are derated and which parameters are reduced. The course is enriched with exercises and real life examples, using real devices datasheets to show where parameters are gathered and how they are used. At the end of the course you will have a broader understanding of the thermal/cooling management and derating aspects, and you will able to design a PCB that is able to manage the dissipated power (and related temperature rise), and properly choose components parameters based on the right derating considerations. Therefore, you will be able to design a PCB that stands thermal and electrical stresses and that actually works and last in the real world environment.
