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所在平台: Udemy |
课程主页: https://www.udemy.com/course/low-power-design-concepts-part1/
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课程名称：VLSI低功耗设计概念（第1部分） 课程概述：在芯片设计中，功耗是芯片设计工程师希望实现低功耗的关键因素。除了硅的缩放，设计师还面临许多挑战，尤其是在深亚微米短通道设计中。设计频率的提升与功耗和面积之间的差距是主要的实施障碍。本课程将使学员掌握在芯片设计中实际应用的多种低功耗技术。 在本课程的第一部分中，主要内容包括： - 功耗元件及其基本方程的介绍 - CMOS电流方程 - 设计中不同的功耗耗散 - 适应性的功耗模式 - 功率网格网络的概念 - 功率网格的电磁（EM）和直流（IR）特性 - 功率网络中的去耦电容（decaps）和活动去耦（active decap） - 微处理器的功率分配网络中的去耦分布 - 多电压系统和多电压功率网格的低功耗方法 在整个设计过程中，低功耗技术的实施贯穿于从架构设计到物理设计（GDSII）的每一个阶段。课程将深入探讨功耗对整个系统单芯片（SoC）设计的贡献，并讨论功率网格网络、设备、RC网络、数据/信号和时钟对功耗的影响。 与本课程第2部分相关的最新方法论，将在后续课程中进行讨论，提供更高级的学习内容。此课程是希望深入了解低功耗设计的重要基础，为芯片设计工程师提供实用的技能与知识。
Power contribution in the chip design is vital one for any chip design engineer who wants to implement low power is the cutting edge goal apart from the silicon scaling then this would be the best course to learn and advanced topics covered in part2. At deep submicron short channel all the time facing multiple design challenges along with silicon scaling. As the frequency of the design is achieving and the major implement gap while achieving frequency is area and power. In this course you are empowered to learn most of the low power techniques which practically uses in chip designing. In this part 1 course covered introduction of the power consuming elements and its basic equations, CMOS current equation, different power dissipation in the design, power modes for robustness, power grid network, Power grid EM and IR, decaps in power network, active decap, decap distribution in power distribution network of micro processor, multi voltage, multi voltage power grid off and its low power methodology before power intent format from IEEE and implementation cells of power grid gating. Power Performance Area are the three challenging sign off goals for any chip designer right from architecture to till GDSII Physical design engineer. All the design duration low power techniques are implemented.Power contribution in entire SOC•Power Grid Network•Devices•RC Network•Data/Signal•Clock•Physical Only CellsPresent trending methodologies are covered in part-2 which is even more advanced way.
