High-Speed Board Design Course System On Module -EsteemPCB

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课程主页: https://www.udemy.com/course/highspeed_board_design_course/

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课程简介

课程名称:高速电路板设计课程 - 系统模块 - EsteemPCB 课程概述:本课程被划分为13个不同的部分,每个部分下都有多个学习内容。具体内容如下: 第一部分:详细讨论需求表及RK3399处理器数据手册。 第二部分:从零开始选择SDRAM(SDR/DDRX/LPDDRX),以及其引脚映射和原理图设计。 第三部分:选择和详细设计PMIC(电源管理IC)的原理图。 第四部分:EMMC(嵌入式多媒体卡)芯片选择、引脚映射与原理图设计。 第五部分:WIFI/蓝牙模块选择、认证(美国/欧盟/加拿大)、选择及原理图设计。 第六部分:选择外部LDO/DC-DC/升降压电源及其详细原理图设计。 第七部分:RK3399的原理图设计、引脚映射和通过网络类别进行的阻抗规划。 第八部分:层叠结构设计(4/6/8/12层),完成组件放置规划及其执行(第1部分)。 第九部分:组件放置规划及其执行(第2部分)。 第十部分:组件放置规划及其执行(第3部分)。 第十一部分:布局规划、初步布局、高速设计规则和长度匹配、按部分进行的电源平面规划、布局优化(第1部分)。 第十二、十三部分:按部分进行的电源平面规划、布局优化。 课程中设计的主要原理图块包括:项目方框图、"电源预算方框图"、"RK3399电源供给原理图"、"RK3399的PMUIO原理图块"、"RK3399的EMMC/PCIE/ADC原理图"、"RK3399的EDP/MIPI-DSI/HDMI原理图"、"RK3399的Type-C/USB3.0/USB2.0主机原理图"、"RK3399的MIPI-CSI/GPIOs/I2C原理图"、"RK3399的MII/RMII/GMII/RGMII原理图"、"RK3399的SDR/DDRx/LPDDRx原理图"、"RK3399的PMIC/DC-DC/LDOs/升降压电源"等,课程中还有许多其他子模块。 您还将学习一些基本的硬件设计模块,如:预原理图设计模块(方框图和电源预算)、层叠结构选择和定义规则、不同接地技术(信号接地、地面接地、机壳接地)、任何PCB的电源分配网络分析(PDN分析),以及磁珠、ESD二极管及其选择的应用。 此外,您还将学习如何在Microsoft Paint上进行放置和布局规划等内容。完成本课程后,您将能够在没有任何仿真模型和第三方支持的情况下设计任何“处理器板”。

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课程详情

I have Divided this Course into #13 Different Sections Under Each Section You will find Multiple Lessons:Section 1: Discuss the Requirement sheet and Processor RK3399 Datasheet in very detail.Section 2: How to Choose a SDRAM (SDR/DDRX/LPDDRX) ? from Very Scratch and Its Pin Mapping and Schematic Design From Datasheet.Section 3: Selection and Schematic Design of PMIC (Power Management IC) in very Details. Section 4: EMMC (Embedded Multimedia Card) Chip Selection, Pin Mapping and Schematic Design.Section 5: WIFI/BT Module Selection, Certification (US/EU/CA), Selection and Schematic Design.Section 6: Selection of External LDO/DC-DC/Buck-Boost and Their Schematic Design in very Details.Section 7: Schematic Design of RK3399, Pin Mapping and Impedances Planning on Schematic through Net-Classes.Section 8: Layer Stack up(4/6/8/12L), Finish the Components Placement Planning and its Execution Part-1Section 9: Components Placement Planning and its Execution Part-2Section 10: Components Placement Planning and its Execution Part-3Section 11: Layout Planning, Preliminary Layout, High Speed Design Rules and Length Matching, Power Plane Planning by Sections, Optimization of Layout Part-1Section 12, 13: Power Plane Planning by Sections, Optimization of Layout.Major Schematic Blocks that I have designed in this course are Project Block Diagram, "Power Budget Block Diagram", "Power Supply Schematic for RK3399", "PMUIO Schematic Block of RK3399", "EMMC/PCIE/ADC Schematic for RK3399", "EDP/MIPI-DSI/HDMI Schematic for RK3399", "Type-C/USB3.0/USB2.0 Hosts Schematic for RK3399", "MIPI-CSI/GPIOs/I2C Schematic of RK3399", "MII/RMII/GMII/RGMII Schematic for RK3399", "SDR/DDRx/LPDDRx Schematic For RK3399", "PMIC/DC-DC/LDOs/Buck-Boost for RK3399" and many more various subparts you will learn in this course as you can see on the curriculum sections and their lessons. You will also Learn some basic hardware designing blocks as well like You will also learn some Basic Blocks as well:Pre-Schematic Design Blocks (Block Diagram and Power Budget)Layer Stack-up Selection and Rules for Defining any Stack-upDifferent Grounding Techniques( Signal Grounding, Earth Grounding, Chassis Grounding)Power Distribution Network Analysis (PDN Analysis) of any PCB. and many more things.Ferrite Bead, ESD Diodes, and Magnetic Application and their selection.How to do Placement and Layout Planning on Microsoft-Paint and many more.After the completion of this course you can design any "Processor Board" without any Simulation models and third party support.

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